Organic Materials

Rubrik: Short Communication

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Ausgabe 01/2023

Park, Yong Cheon; Jeong, Kihoon; Ahn, Dahye; Kim, Youson; Im, Sung Gap: A Low-Temperature Curable Conformal Adhesive Layer for Monolithic Lamination of Thin Film Encapsulation
https://www.thieme-connect.de/media/10.1055-s-00040992/202301/10-1055-a-2012-2147-iom0047toc.jpg